Alumina Ceramic Metallization Structural Assembly​

1. Description of metallization structural assembly​

Metallization Structural Assembly​ is produced by high purity complex alumina and nano metallization. It is suitable for brazing of different materials such as copper, aluminum and other metals. It is applying to sealed switch, HVDC Relay and other parts,it is made of 95% aluminum oxide.

2.Key Words:

Manufacture samples , open mould ,aluminum oxide,thick-film nickel plating technology,copper and alloys,great limberness,Good corrosion resistance,High intensity,Good high-temperature resistance performance,High purity.

3. Parameters:

Hunan Meicheng Ceramics Technology Co., Ltd. was established in August 2010 with a registered capital of 36.8 million yuan. It is a modern large-scale special ceramics enterprise integrating R&D, production and sales. It passed the national high-tech enterprise certification in 2014. The company is located in the Special Ceramics Industrial Park of the Economic Development Zone of Xinhua County with a beautiful environment, covering an area of 40000 Sq.m. It is the first enterprise to settle in the Special Ceramics Industrial Park.

Meicheng consists of ceramics division, new energy division, sensor division, brazing division, mainly engaged in the research and application of zirconia ceramics, alumina ceramics, talc ceramics and other non-oxide ceramics. The production mainly adopts dry pressing process, supplemented by injection molding and tape casting process, and expands 3D ceramic printing: It has advanced ceramic nano metallization technology, ceramic brazing and ceramic finishing capabilities.

Meicheng has a professional R&D and testing platform, a mold making center and a raw material distribution base. And successively established long-term industry-university-research cooperation relations with Tsinghua University, Central South University, Hunan University, Changsha University of Science and Technology and other universities. Products are widely used in electronic appliances, communication interconnection, electric vehicles, urban light rail, aerospace, robotics and other fields.